The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2008

Filed:

Jul. 31, 2002
Applicants:

Junichiro Ichikawa, Tokyo, JP;

Takahisa Fujita, Tokyo, JP;

Yuji Yamane, Tokyo, JP;

Norikazu Miyazaki, Tokyo, JP;

Mitsuru Sakuma, Tokyo, JP;

Inventors:

Junichiro Ichikawa, Tokyo, JP;

Takahisa Fujita, Tokyo, JP;

Yuji Yamane, Tokyo, JP;

Norikazu Miyazaki, Tokyo, JP;

Mitsuru Sakuma, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/35 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention offers an optical modulator capable of efficiently transmitting electric signals to an interaction part of a signal electrode with acting on an optical waveguide even when the electric signals are in a high frequency zone, and capable of performing high frequency broad-band operation. The optical modulator comprises a substrateformed of a material having electro-optical effect, an optical waveguide formed on the substrate, and an electrodefor modulating the light passing through the optical waveguide. The optical modulator is characterized in that an electric signal connection pad unitis provided on a part of the electrode, and in that the thickness of the substrate located on a lower part of at least the electric signal connection pad unitand directly or indirectly continuous to the electric signal connection pad unitis thinner than the thickness of another part of the substrate including an interaction part of the electrode by cutting off a part of the substrate, and is less than about 250 μm.


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