The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Jan. 04, 2005
Applicants:
Hiroyuki Onishi, Aichi-ken, JP;
Toshiaki Nagase, Aichi-ken, JP;
Jun Ishikawa, Aichi-ken, JP;
Koichi Akagawa, Aichi-ken, JP;
Inventors:
Hiroyuki Onishi, Aichi-ken, JP;
Toshiaki Nagase, Aichi-ken, JP;
Jun Ishikawa, Aichi-ken, JP;
Koichi Akagawa, Aichi-ken, JP;
Assignee:
Kabushiki Kaisha Toyota Jidoshokki, Kariya-shi, Toyota, unknown;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor apparatus is characterized in that it comprises a semiconductor module having a plurality of semiconductor elements and an external connection terminal for externally connecting electrodes of the semiconductor elements in the semiconductor module, wherein the semiconductor elements in each semiconductor module are connected in parallel and/or in series via the external connection terminal.