The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Jun. 28, 2006
Bruce C. S. Chou, Hsin Chu, TW;
Chen-chih Fan, Chu Pei, TW;
Bruce C. S. Chou, Hsin Chu, TW;
Chen-Chih Fan, Chu Pei, TW;
LighTuning Tech. Inc., Hsinchu, TW;
Abstract
A structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) includes a semiconductor substrate, and a sweep-type fingerprint sensing chip formed on the semiconductor substrate, a polymer layer and a conducting metal layer. The sweep-type fingerprint sensing chip includes a sensing array region and a peripheral circuit region. The sensing array region has an exposed area for sensing a plurality of fingerprint fragment images as a finger sweeps thereacross. The peripheral circuit region, which is formed on the substrate and located around the sensing array region, controls an operation of the sensing array region. The polymer layer is disposed on the peripheral circuit region and has a flat and smooth outer surface. The conducting metal layer is disposed on the flat and smooth outer surface of the polymer layer. The conducting metal layer discharges the approaching electrostatic charges to the ground to avoid damaging of the sensing chip.