The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Apr. 15, 2003
Applicants:
Dietrich Mund, Obersüssbach, DE;
Jürgen Leib, Freising, DE;
Inventors:
Dietrich Mund, Obersüssbach, DE;
Jürgen Leib, Freising, DE;
Assignee:
Schott AG, Mainz, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.