The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Dec. 09, 2003
Kazuyuki Nakanishi, Seto, JP;
Tadashi Oshima, Aichi-gun, JP;
Hideo Hasegawa, Negoya, JP;
Hiroyuki Mori, Nisshin, JP;
Hideo Tachikawa, Nisshin, JP;
Yukio Miyachi, Owariasahi, JP;
Yasushi Yamada, Nishikamo-gun, JP;
Hiroyuki Ueda, Kasugai, JP;
Masayasu Ishiko, Nagoya, JP;
Kazuyuki Nakanishi, Seto, JP;
Tadashi Oshima, Aichi-gun, JP;
Hideo Hasegawa, Negoya, JP;
Hiroyuki Mori, Nisshin, JP;
Hideo Tachikawa, Nisshin, JP;
Yukio Miyachi, Owariasahi, JP;
Yasushi Yamada, Nishikamo-gun, JP;
Hiroyuki Ueda, Kasugai, JP;
Masayasu Ishiko, Nagoya, JP;
Kabushiki Kaisha Toyota Chuo Kenkyusyo, Aichi-gun, JP;
Abstract
A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.