The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7396575 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 08, 2008

Filed:

Aug. 15, 2006
Applicant:

Yoshihito Fukushima, Miyagi, JP;

Inventor:

Yoshihito Fukushima, Miyagi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B33B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Preventing a molded disc substrate from generating a separation pattern. To this end, a molding dieincludes a pair of stationary dieand movable die, and an outer circumference ringfor molding an outer circumference end of the disc substrate. The outer circumference ringis so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable dietoward the stationary die, and has a retaining surfacefor retaining the outer circumference of the molded disc substrate


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Fukushima, Yoshihito. (2008). Molding die apparatus, method for disc substrate, and disc-shaped recording medium (U.S. Patent No. 7396575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7396575

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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