The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2008

Filed:

Sep. 05, 2007
Applicants:

Ken J. Hayworth, Northridge, CA (US);

Karl Y. Yee, Pasadena, CA (US);

Kirill V. Shcheglov, Los Angeles, CA (US);

Youngsam Bae, Gardena, CA (US);

Dean V. Wiberg, La Crescenta, CA (US);

A. Dorian Challoner, Manhattan Beach, CA (US);

Chris S. Peay, Alhambra, CA (US);

Inventors:

Ken J. Hayworth, Northridge, CA (US);

Karl Y. Yee, Pasadena, CA (US);

Kirill V. Shcheglov, Los Angeles, CA (US);

Youngsam Bae, Gardena, CA (US);

Dean V. Wiberg, La Crescenta, CA (US);

A. Dorian Challoner, Manhattan Beach, CA (US);

Chris S. Peay, Alhambra, CA (US);

Assignees:

California Institute of Technology, Pasadena, CA (US);

The Boeing Company, Chicago, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.


Find Patent Forward Citations

Loading…