The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Sep. 29, 2004
Manabu Inoue, Kuki, JP;
Kazuhiro Sukenari, Chiba-ken, JP;
Noriko Matsumoto, Toride, JP;
Tomoyuki Konuma, Kashiwa, JP;
Tatsuo Shigeta, Nagareyama, JP;
Manabu Inoue, Kuki, JP;
Kazuhiro Sukenari, Chiba-ken, JP;
Noriko Matsumoto, Toride, JP;
Tomoyuki Konuma, Kashiwa, JP;
Tatsuo Shigeta, Nagareyama, JP;
Think Laboratory Co., Ltd., Chiba-Ken, JP;
Abstract
There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and a mirror surface finish grinding not depending on a grinding stone grinding can be carried out in a short period of time and a high quality roll can be provided. The grinding is carried out after applying the copper sulfate plating to the roll to attain a mirror surface finish state. The copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to the rotating process roll and approached to the lower surface of the roll, plating liquid having some avoidable impurities becoming a cause of particles or pits removed through a filter so as to perform a plating having no thickened portions at both ends of the roll.