The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Dec. 01, 2005
Tatsuya Arai, Kanagawa, JP;
Toshiyuki Takada, Kanagawa, JP;
Tatsuya Arai, Kanagawa, JP;
Toshiyuki Takada, Kanagawa, JP;
Hirose Electric Co., Ltd., Tokyo, JP;
Abstract
A multilayer interconnection board () comprises a dielectric substrate (), a through-hole (), a signal line () having a large width section (A) and a small width section (B) connected with the through-hole (), and a ground layer (). A length L (mm) of the small width section (B) meets the formula of 0<L≦(3×10)/(F×√ε), wherein, ε denotes the dielectric constant of the dielectric substrate () and F (Hz) denotes the frequency of a signal transmitted through the signal line (). The ratio (W/W) of a line width Wof the small width section (B) relative to a line width Wof the large width section (A) is determined to be smaller as the length of a stub portion of the through-hole () becomes larger.