The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Sep. 10, 2007
Applicants:
Eric Yakobson, Aliso Viejo, CA (US);
Richard Hurtubise, Clinton, CT (US);
Christian Witt, Woodbridge, CT (US);
Qingyun Chen, Branford, CT (US);
Inventors:
Eric Yakobson, Aliso Viejo, CA (US);
Richard Hurtubise, Clinton, CT (US);
Christian Witt, Woodbridge, CT (US);
Qingyun Chen, Branford, CT (US);
Assignee:
Enthone Inc., West Haven, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
Quick Actions:
Yakobson, Eric. (2008). Capping of metal interconnects in integrated circuit electronic devices (U.S. Patent No. 7393781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7393781
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile