The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2008

Filed:

Jul. 28, 2006
Applicant:

Mao-yi Chang, Hsinchu County, TW;

Inventor:

Mao-Yi Chang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of fabricating polysilicon film includes forming insulating layer, first amorphous silicon layer, and cap layer over a substrate. An annealing is performed to transform the first amorphous silicon layer into first polysilicon layer with at least a hole. The cap layer is removed. A portion of the insulating layer within the hole is removed to form first opening within the insulating layer. The hole and the first opening constitute a second opening. A dielectric layer is formed over the first polysilicon layer. The dielectric layer also fills the second opening, causing a recess on the dielectric layer above the second opening. A second amorphous silicon layer is formed over the dielectric layer. A second annealing is performed to transform the second amorphous silicon layer into a second polysilicon layer. The second opening induces a thermal difference so as to cause a crystallizing direction for the second amorphous silicon layer.


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