The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
May. 12, 2005
Andreas Huber, München, DE;
Günter Gerstmeier, Hilg.-Tandern, DE;
Michael Bernhard Sommer, Raubling, DE;
Andreas Huber, München, DE;
Günter Gerstmeier, Hilg.-Tandern, DE;
Michael Bernhard Sommer, Raubling, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A metallization surface (), which acts as an etching stop layer during the production of openings () in a passivation layer () applied to its upper face and protects an interconnect structure () arranged underneath it, is arranged in an uppermost metallization level (). A further opening is produced in the metal surface (), through which a focused ion beam is aimed at the interconnect structure () in order to connect interconnects to one another and/or to interrupt at least one interconnect. The wiring of the integrated circuit can thus be varied individually, starting from identically produced semiconductor chips.