The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Feb. 08, 2006
Mark A. Smith, Corvallis, OR (US);
William R Boucher, Corvallis, OR (US);
Charles C Haluzak, Corvallis, OR (US);
Mark A. Smith, Corvallis, OR (US);
William R Boucher, Corvallis, OR (US);
Charles C Haluzak, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.