The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Nov. 12, 2004
Tohru Yamasaki, Matogata-cho, Himeji-shi, Hyogo, JP;
Takayasu Mochizuki, Shibuya-ku, Tokyo, JP;
Tohru Yamasaki, Matogata-cho, Himeji-shi, Hyogo, JP;
Takayasu Mochizuki, Shibuya-ku, Tokyo, JP;
Other;
Abstract
A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical characteristics and/or chemical resistance and a second layer excellent in electrical characteristics such as electrical conductivity. The first and the second layers are adhered to each other in atomic level directly at their interface, with composition gradient at their interface, or with an adherence buffer layer such as a copper thin film interposed therebetween. The first layer is at first deposited on an electrode substrate. The second layer is deposited on the first layer. Deposition is repeatedly carried out in such a way that the first layers on opposite sides of the second layer are equal in thickness. Finally, the electrode substrate is dissolved and removed.