The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Apr. 22, 2002
Applicants:
Yoshihiro Okada, Okayama, JP;
Atsushi Ebara, Honjo, JP;
Inventors:
Yoshihiro Okada, Okayama, JP;
Atsushi Ebara, Honjo, JP;
Assignee:
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B32B 5/16 (2006.01); C23C 22/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A highly oxidation-resistant copper powder for conductive paste, which is a copper powder containing not more than 5 wt % of Si, is characterized in that substantially all of the Si is adhered to the surfaces of the copper particles as SiO-system gel coating film.
Okada, Yoshihiro. (2008). Highly oxidation-resistant copper powder for conductive paste and process for producing the powder (U.S. Patent No. 7393586). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7393586
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile