The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2008

Filed:

Oct. 20, 2000
Applicants:

Yuji Maeda, Nanta, JP;

Koji Nakanishi, Nanta, JP;

Nobuo Tokai, Nanta, JP;

Ichiro Kawai, Nanta, JP;

Inventors:

Yuji Maeda, Nanta, JP;

Koji Nakanishi, Nanta, JP;

Nobuo Tokai, Nanta, JP;

Ichiro Kawai, Nanta, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C23C 14/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

On a wafer holding areaon the upper surface of a susceptora wafer W is supported by a wafer supportsuch that a gap with a predetermined distance is formed between the wafer W and a wafer heating surfaceA projectionthat decreases the distance of the gap with respect to the wafer W is formed on the wafer heating surfaceAt this time, the heating condition for the wafer W by the susceptoris adjusted by means of the distances of the gaps at the respective portions of the wafer holding area. Thus, the uniformity of the planar temperature distribution of the wafer W and that of the thickness distribution of the formed film can be improved.


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