The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2008

Filed:

May. 30, 2007
Applicants:

Guy Castonguay, Ft. Worth, TX (US);

Michael Heath Rasmussen, Keller, TX (US);

Konstantinos Saravanos, Highland Village, TX (US);

Inventors:

Guy Castonguay, Ft. Worth, TX (US);

Michael Heath Rasmussen, Keller, TX (US);

Konstantinos Saravanos, Highland Village, TX (US);

Assignee:

Corning Cable Systems LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01); G02B 6/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A compact optical splitter module is disclosed. One type of compact optical splitter module is a planar attenuated splitter module that includes a branching waveguide network having j≧1 50:50 splitters that form up to n≦2output waveguides having associated n output ports, wherein only m<n output ports are suitable for transmitting light to the at least one external output device. This provides a 1×m splitter module wherein each output port has the attenuation of a 1×n splitter module, thereby obviating the need for external attenuation. Another type of compact optical splitter module is a direct-connect splitter module that eliminates the need for an optical fiber array when coupling to external optical fibers. Another type of compact optical splitter module is a microsplitter module that serves as device and module at the same time and that eliminates the differentiation between device and module. The integration of device and module also makes manufacturing the microsplitter module cost-effect. Embodiments of microsplitter modules that account for differences in the coefficient of thermal expansion of the materials making up the microsplitter are also disclosed.


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