The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Nov. 28, 2005
Yoshimitsu Takahata, Tokyo, JP;
Hiroshi Nakamura, Tokyo, JP;
Masaaki Taruya, Tokyo, JP;
Shinsuke Asada, Tokyo, JP;
Yoshimitsu Takahata, Tokyo, JP;
Hiroshi Nakamura, Tokyo, JP;
Masaaki Taruya, Tokyo, JP;
Shinsuke Asada, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package () made of a resin and having a concave portion (), a lead () formed integral with the package () by insert molding, with its one end exposed into the concave portion () and its other end extended from the package () to the outside, a sensor chip () arranged in the concave portion () for detecting pressure, and a bonding wire () electrically connecting the sensor chip () and the lead () with each other. An interface between the lead () and the package () on the side of the concave portion () is covered with a first protective resin portion () of electrically insulating property, and the bonding wire () is covered with a second protective resin portion () that is softer than the first protective resin portion ().