The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2008

Filed:

Jan. 31, 2006
Applicants:

Hiroyuki Arima, Yokohama, JP;

Masanobu Okayasu, Yokohama, JP;

Osamu Kagaya, Tokyo, JP;

Kazuhiko Naoe, Yokohama, JP;

Tetsuya Kato, Hiratsuka, JP;

Inventors:

Hiroyuki Arima, Yokohama, JP;

Masanobu Okayasu, Yokohama, JP;

Osamu Kagaya, Tokyo, JP;

Kazuhiko Naoe, Yokohama, JP;

Tetsuya Kato, Hiratsuka, JP;

Assignee:

Opnext Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance between the transmission lines can be reduced. Thereby, the lengths of wires for connecting the transmission lines can be reduced so as to improve frequency characteristics of an optical modulator module.


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