The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Mar. 25, 2005
Tsuneo Sato, Saitama, JP;
Atsuhiko Ishihara, Saitama, JP;
Akihiro Uchida, Saitama, JP;
Koji Kaseda, Saitama, JP;
Masahiro Kato, Saitama, JP;
Shigeru Kondo, Saitama, JP;
Tsuneo Sato, Saitama, JP;
Atsuhiko Ishihara, Saitama, JP;
Akihiro Uchida, Saitama, JP;
Koji Kaseda, Saitama, JP;
Masahiro Kato, Saitama, JP;
Shigeru Kondo, Saitama, JP;
Fujifilm Corporation, Tokyo, JP;
Abstract
A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.