The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2008

Filed:

Feb. 17, 2006
Applicants:

Chil-nam Yoon, Suwon-si, KR;

Kwang-seop Kim, Yongin-si, KR;

Do-hyung Kim, Yongin-si, KR;

Jae-jun Lee, Seongnam-si, KR;

Ki-hyun Ko, Yongin-si, KR;

Inventors:

Chil-Nam Yoon, Suwon-si, KR;

Kwang-Seop Kim, Yongin-si, KR;

Do-Hyung Kim, Yongin-si, KR;

Jae-Jun Lee, Seongnam-si, KR;

Ki-Hyun Ko, Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sodes which same signal applying balls of the memory chips contact in the mirror form, wherein a via is formed at a location close to the same signal applying contact pad of one side among the same signal applying contact pads arranged on both sides in the mirror form, the via connecting the other side to the signal line of one side, and a signal transmitted from the other side is connected to a contact junction, the contact junction is connected to the same signal applying contact pad of the other side, the contact junction is connected to the via of the other side, and the via of one side is connected to the same signal applying contact pad of one side.


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