The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Oct. 14, 2005
Axel Brintzinger, Dresden, DE;
Stefan Ruckmich, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Fritz Uhlendorf, Legal Representative, Stade, DE;
David Wallis, Dresden, DE;
Axel Brintzinger, Dresden, DE;
Stefan Ruckmich, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Fritz Uhlendorf, legal representative, Stade, DE;
David Wallis, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and the second surfaces, thereby uncovering a first contact location on the first surface and a second contact location on the second surface; applying a protective layer to the second surface in order to protect the corresponding masking layer and the second contact location during subsequent method steps; applying a first conductor structure to the first surface, the first conductor structure on the first surface covering the first contact location; removing the protective layer on the second surface; and applying a second conductor structure to the second surface, the second conductor structure on the second surface covering the second contact location.