The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Apr. 05, 2004
Applicants:
Yukio Takigawa, Kawasaki, JP;
Tamotsu Yamamoto, Kawasaki, JP;
Yoshiyuki Okura, Kawasaki, JP;
Takahiro Kono, Kawasaki, JP;
Tsutomu Hosoda, Kawasaki, JP;
Inventors:
Yukio Takigawa, Kawasaki, JP;
Tamotsu Yamamoto, Kawasaki, JP;
Yoshiyuki Okura, Kawasaki, JP;
Takahiro Kono, Kawasaki, JP;
Tsutomu Hosoda, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating a semiconductor device comprises the steps of: forming interconnection groovesin an inter-layer insulation film; forming an interconnection layerof Cu as the main material in the interconnection grooves; and concurrently injecting nitrogen gas and water to the surface of the interconnection layerburied in the interconnection groove