The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Apr. 21, 2005
Stephen Ellwood, Cambridge, GB;
Stephen Ellwood, Cambridge, GB;
Artimi Ltd., Cambridge, Cambridgeshire, GB;
Abstract
This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry and digital circuitry. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising: connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad. Preferably at least some of the bond pads for the digital circuitry are directly connected to the substrate pads, for example by wire bonding.