The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2008

Filed:

Mar. 31, 2005
Applicants:

Wensheng Wang, Kawasaki, JP;

Takashi Ando, Machida, JP;

Yukinobu Hikosaka, Kawasaki, JP;

Inventors:

Wensheng Wang, Kawasaki, JP;

Takashi Ando, Machida, JP;

Yukinobu Hikosaka, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A PLZT film () is formed as the material film of a capacitor dielectric film and a top electrode film () is formed on the PLZT film (). The top electrode film () comprises two IrOfilms having different composition. Subsequently, back face of a semiconductor substrate () is cleaned and an Ir adhesion film () is formed on the top electrode film (). Substrate temperature is set at 400° C. or above at that time. Thereafter, a TiN film and a TEOS film are formed sequentially as a hard mask. In such a method, carbon remaining on the top electrode film () after cleaning the back face is discharged into the chamber while the temperature of the semiconductor substrate () is kept at 400° C. or above in order to form the Ir adhesion film (). Consequently, adhesion is enhanced between a TiN film being formed subsequently and the Ir adhesion film () thus preventing the TiN film from being stripped.


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