The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Mar. 03, 2003
Hideki Kashihara, Osaka, JP;
Masamichi Yamamoto, Osaka, JP;
Jun Yorita, Hyogo, JP;
Hideaki Toshioka, Osaka, JP;
Misako Osoegawa, Osaka, JP;
Keiji Koyama, Osaka, JP;
Masatoshi Majima, Osaka, JP;
Yoshie Tani, Osaka, JP;
Hideki Kashihara, Osaka, JP;
Masamichi Yamamoto, Osaka, JP;
Jun Yorita, Hyogo, JP;
Hideaki Toshioka, Osaka, JP;
Misako Osoegawa, Osaka, JP;
Keiji Koyama, Osaka, JP;
Masatoshi Majima, Osaka, JP;
Yoshie Tani, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 μm-20 μm when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.