The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Sep. 22, 2005
Thomas I. Wallow, Fremont, CA (US);
Marion C. Hunter, Livermore, CA (US);
Karen Lee Krafcik, Livermore, CA (US);
Alfredo M. Morales, Livermore, CA (US);
Blake A. Simmons, San Francisco, CA (US);
Linda A. Domeier, Danville, CA (US);
Thomas I. Wallow, Fremont, CA (US);
Marion C. Hunter, Livermore, CA (US);
Karen Lee Krafcik, Livermore, CA (US);
Alfredo M. Morales, Livermore, CA (US);
Blake A. Simmons, San Francisco, CA (US);
Linda A. Domeier, Danville, CA (US);
Sandia Corporation, Livermore, CA (US);
Abstract
We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.