The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2008

Filed:

Jun. 30, 2005
Applicants:

Byron V. Bell, Paris, KY (US);

Robert W. Cornell, Lexington, KY (US);

Yimin Guan, Lexington, KY (US);

Burton L. Joyner, Ii, Lexington, KY (US);

Inventors:

Byron V. Bell, Paris, KY (US);

Robert W. Cornell, Lexington, KY (US);

Yimin Guan, Lexington, KY (US);

Burton L. Joyner, II, Lexington, KY (US);

Assignee:

Lexmark International, Inc., Lexington, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure is directed to a micro-fluid ejection head for a micro-fluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.


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