The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2008

Filed:

Oct. 11, 2006
Applicants:

Akira Toda, Kanagawa, JP;

Tatsushiro Hirata, Kanagawa, JP;

Inventors:

Akira Toda, Kanagawa, JP;

Tatsushiro Hirata, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 17/00 (2006.01); G01F 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fluid-structure coupled numerical simulation method is provided. The method uses a finite volume method employing an orthogonal mesh and a computer and memory setting a solid area based on a solid rate inside a mesh and at a tangent position to each mesh, including the steps of: setting initial and boundary conditions of a moving film structure; setting a velocity boundary in the tangent direction of the film structure by computing a position and shape thereof; and computing a curvature thereof. The method further includes the step of computing a pressure balance based on a balance between a pressure obtained from a fluid computation and a repulsive force obtained from the tension and curvature of the film structure to implement processing of a mutually-coupled phenomenon. A shift amount of the film surface for each time of said computing steps is simulated using the same program.


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