The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Dec. 12, 2006
Robert T. Worl, Renton, WA (US);
Bruce L. Blaser, Auburn, WA (US);
Peter T. Heisen, Kent, WA (US);
Julio A. Navarro, Kent, WA (US);
Douglas A. Pietila, Puyallup, WA (US);
Scott A. Raby, Redmond, WA (US);
Jimmy S. Takeuchi, Mercer Island, WA (US);
Robert T. Worl, Renton, WA (US);
Bruce L. Blaser, Auburn, WA (US);
Peter T. Heisen, Kent, WA (US);
Julio A. Navarro, Kent, WA (US);
Douglas A. Pietila, Puyallup, WA (US);
Scott A. Raby, Redmond, WA (US);
Jimmy S. Takeuchi, Mercer Island, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.