The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Oct. 17, 2005
Kyoung-woo Lee, Fishkill, NY (US);
Seung-man Choi, Fishkill, NY (US);
Kyoung-Woo Lee, Fishkill, NY (US);
Seung-Man Choi, Fishkill, NY (US);
Samsung Electronics Co., Ltd, , KR;
Abstract
Copper-based metallization is formed in a trench on an integrated circuit substrate by forming a liner of refractory metal in the trench using physical vapor deposition, forming a copper plating seed layer on the liner using physical vapor deposition and then plating copper on the copper plating seed layer. Prior to plating copper on the copper plating seed layer, the liner and/or copper plating seed layer is stuffed with hydrogen, for example by exposing the liner and/or copper plating seed layer to a hydrogen-containing plasma during and/or after formation of the liner and/or copper plating seed layer. Related structures also are disclosed.