The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2008

Filed:

Sep. 16, 2004
Applicants:

Dennis Leon Deavenport, Houston, TX (US);

John Lawrence Thornton, Jr., League City, TX (US);

Nam Hung Tran, Pasadena, TX (US);

Samuel Stewart Newberg, Vernon Hills, IL (US);

Inventors:

Dennis Leon Deavenport, Houston, TX (US);

John Lawrence Thornton, Jr., League City, TX (US);

Nam Hung Tran, Pasadena, TX (US);

Samuel Stewart Newberg, Vernon Hills, IL (US);

Assignee:

Akzo Nobel N.V., Arnhem, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/12 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for depositing a substantially pure, conformal metal layer on one or more substrates through the decomposition of a metal-containing precursor. During this deposition process, the substrate(s) is maintained at a temperature greater than the decomposition temperature of the precursor while the surrounding atmosphere is maintained at a temperature lower than the decomposition temperature of the precursor. The precursor is dispersed within a transport medium, e.g., a vapor phase. The concentration of the metal-containing precursor(s) in the vapor phase, which also contains liquid therein, can be at a level to provide conditions at or near saturation for the metal precursor(s). In ensuring the aforementioned temperature control between the transport media and substrate, and in maintaining saturation conditions for the transport media, the quality of the deposited metal thin film is markedly improved and the production of by-product metal dust is greatly reduced or substantially eliminated.


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