The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2008

Filed:

Dec. 21, 2004
Applicants:

Wataru Koga, Kyoto, JP;

Yoshifumi Yamagata, Kyoto, JP;

Shigehiko Nagamine, Kyoto, JP;

Inventors:

Wataru Koga, Kyoto, JP;

Yoshifumi Yamagata, Kyoto, JP;

Shigehiko Nagamine, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a surface acoustic wave device, an excitation electrodein a surface acoustic wave element is provided on a lower surface of a piezoelectric substrate, and the lower surface of the piezoelectric substrateis disposed in a state where it is opposed to an upper surface of a mounting base member. The surface acoustic wave device comprises a through holepenetrating between the upper surface and a lower surface of the mounting base member, a lead electrodeclosing the through holeand formed so as to extend to the lower surface of the mounting base member, and an insulatorcovering the lead electrodeso as to expose its partial area. When the surface acoustic wave device is mounted on a circuit board or the like, therefore, the through holeis closed by the insulator, so that no bubbles are produced in the through hole, and cracks can be prevented from appearing, thereby making it possible to provide a highly reliable surface acoustic wave device having no inferior connection or the like.


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