The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Sep. 20, 2005
Applicants:
Masao Mizuno, Kobe, JP;
Takashi Onishi, Kobe, JP;
Inventors:
Masao Mizuno, Kobe, JP;
Takashi Onishi, Kobe, JP;
Assignee:
Kobe Steel, Ltd., Kobe-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A Cu alloy for semiconductor interconnections contains at least one selected from the group consisting of 0.10 to 10 atomic percent of Sb, 0.010 to 1.0 atomic percent of Bi, and 0.01 to 3 atomic percent of Dy, with the balance being Cu and inevitable impurities. The Cu alloy can be reliably embedded in narrow trenches and/or via holes for interconnections.
Quick Actions:
Mizuno, Masao. (2008). Copper alloy, fabrication method thereof, and sputtering target (U.S. Patent No. 7385293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7385293
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile