The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Apr. 08, 2004
Takehiro Suzuki, Kuwana, JP;
Takehiro Suzuki, Kuwana, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
It is an object of the present invention to provide a semiconductor device that offers a desirable adhesiveness among the bonding pad, the second insulating layer and the insulating film, and that permits an insulating film formed between a bonding pad and the second wiring layer from being cracked even when stress is applied to the bonding pad from above. In a semiconductor integrated circuit, other wiringsare formed so as to avoid the regions right under opposed edgesandof the bonding padand opposed edgesandof an inner lead. For example, the region in which the other wiringscan be formed is selected to be a regionbetween right under the edgeof the bonding padand right under the edgeof the inner lead, and the regionbetween right under the edgeand right under the edgeof the inner lead. A insulating filmformed above these other wiringsis made up of an inorganic insulating film only.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile