The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Mar. 22, 2005
Ya-ting Ho, Hsin-Chu, TW;
Li-hui Chen, Hsin-Chu, TW;
Ya-Ting Ho, Hsin-Chu, TW;
Li-Hui Chen, Hsin-Chu, TW;
Au Optronics Corporation, Hsin-Chu, TW;
Abstract
A thermal bonding structure and manufacture process of a flexible printed circuit (FPC) board are disclosed, and the thermal bonding structure includes a laminated structure having a first insulating layer with a solder pad area and showing parts of a first conductive layer, the first conductive layer, a second insulating layer, a second conductive layer, and a third insulating layer with a bonding area such that a part of the second conductive layer is exposed, and at least a through hole passing through the first conductive layer to the second conductive layer for propagating heat energy to fuse a solder. Accordingly, the reduction of heat energy lost in the third insulating layer improves the bonding quality, shortens the bonding period, and maintains the material stability under high temperature resulted from high heat energy.