The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Apr. 28, 2006
Heng Keong Yip, Selangor Darul Ehsan, MY;
Lan Chu Tan, Selangor, MY;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Lan Chu Tan, Selangor, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of forming a semiconductor package (and) includes providing a substrate () having a die pad and bond pads on a first surface () and conductive pads (and) on a second surface (). An integrated circuit (IC) die () is attached to the die pad and the first surface () of the substrate () is attached to a lead frame (). The substrate () is electrically connected to the lead frame (), and the IC die () is electrically connected to the substrate () and the lead frame (). The IC die (), the electrical connections (and), a portion of the substrate () and a portion of the lead frame () are encapsulated with a mold compound (), forming a stackable package (). The conductive pads (and) on the second surface () of the substrate () are not encapsulated by the mold compound ().