The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Sep. 10, 2004
Yoshiaki Echigo, Uji, JP;
Jusirou Eguchi, Uji, JP;
Akira Shigeta, Uji, JP;
Makoto Uchida, Saitama, JP;
Shigeru Moteki, Annaka, JP;
Yoshiaki Echigo, Uji, JP;
Jusirou Eguchi, Uji, JP;
Akira Shigeta, Uji, JP;
Makoto Uchida, Saitama, JP;
Shigeru Moteki, Annaka, JP;
Unitika Ltd., Hyogo, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 μm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.