The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Sep. 04, 2003
Eiji Kawamoto, Ibaraki, JP;
Masaaki Hayama, Nara, JP;
Masaaki Katsumata, Hirakata, JP;
Hiroki Yabe, Moriguchi, JP;
Takeo Yasuho, Neyagawa, JP;
Eiji Kawamoto, Ibaraki, JP;
Masaaki Hayama, Nara, JP;
Masaaki Katsumata, Hirakata, JP;
Hiroki Yabe, Moriguchi, JP;
Takeo Yasuho, Neyagawa, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove () is formed in a solder resist () located between two electrodes () to which a circuit component () is connected. A configuration is used in which the space between the first groove () and circuit component () is filled with a first insulating resin ().