The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
May. 15, 2002
Peter Rieve, Windeck-Dattenfeld, DE;
Marcus Walder, Wipperfürth, DE;
Konstantin Seibel, Siegen, DE;
Jens Prima, Gehrde, DE;
Reinhard Ronneberger, Dresden, DE;
Markus Scholz, Kreuztal Krombach, DE;
Tarek Lulé, Dresden, DE;
Peter Rieve, Windeck-Dattenfeld, DE;
Marcus Walder, Wipperfürth, DE;
Konstantin Seibel, Siegen, DE;
Jens Prima, Gehrde, DE;
Reinhard Ronneberger, Dresden, DE;
Markus Scholz, Kreuztal Krombach, DE;
Tarek Lulé, Dresden, DE;
STMicroelectronics NV, Amsterdam, NL;
Abstract
The invention relates to an optoelectronic component for converting electromagnetic radiation into an intensity-dependent photoelectric current. The component includes one substrate which is formed especially according to CMOS technology. The substrate has an integrated semiconductor structure and an optically active thin layer structure which is situated upstream in the direction of light incidence. The structure includes a layer of a transparent conductive material and at least one layer of semiconductor material, which are arranged on an isolating layer, inside which connection means are provided for establishing a connection between the optically active thin layer structure and the integrated semiconductor structure arranged on the substrate. The aim of the invention is to develop one such optoelectronic component in such a way that the electrical connection between the layer of transparent conductive material and an electrical potential connection can be established in a technically simple manner. To this end, the layer of transparent conductive material can be connected to the potential connection arranged outside the pixel arrangement by means of an additional conductive structure formed on the substrate.