The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Apr. 21, 2006
Hisaya Sakai, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Hisaya Sakai, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
After a via hole () to connect a lower wiring () and an upper wiring not shown is formed in an insulating film () using an etching stopper film () and a hard mask (), a base film () made from Ta is formed over the insulating film () so as to cover an inner wall of the via hole () by a one-step low-power bias sputtering method of the present invention. Thus, the base film () with a thin and uniform film thickness covering a region from an inner wall surface of the via hole () to the insulating film () is obtained. This makes it possible to form the base film thin and uniformly over the inner wall surface, that is, from a sidewall surface to a bottom surface, of the opening without causing any disadvantage in terms of wiring formation by relatively simple steps, thereby realizing a highly reliable ultra-fine wiring structure.