The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Feb. 12, 2007
Chirayarikathuveedu Premachandran Sankarapillai, Singapore, SG;
Ranganathan Nagarajan, Singapore, SG;
Mohanraj Soundarapandian, Singapore, SG;
Chirayarikathuveedu Premachandran Sankarapillai, Singapore, SG;
Ranganathan Nagarajan, Singapore, SG;
Mohanraj Soundarapandian, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
A substrate having target transfer regions thereon is provided. A sacrificial wafer is coated with a polymer layer with low adhesion to metals. A conductive layer is coated on the polymer layer and covered with a photoresist layer which is patterned to provide openings to the conductive layer. Thin film and passive or active device structures are formed on the conductive layer within the openings. The substrate is bonded to the sacrificial wafer wherein the thin film and passive or active device structures and the photoresist layer provide the bonding and wherein the thin film and passive or active device structures contact the substrate at the target transfer regions. The photoresist is stripped in a high frequency agitation bath wherein the photoresist separates from the sacrificial wafer and wherein the thin film and passive or active device structures separate from the polymer layer to complete transfer bonding.