The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Oct. 14, 2004
Yongan Yan, Thousand Oaks, CA (US);
Douglas Meyers, Calabasas, CA (US);
Mark Morris, Calabasas, CA (US);
D. Laurence Meixner, Camarillo, CA (US);
Satyabrata Raychaudhuri, Thousand Oaks, CA (US);
Yongan Yan, Thousand Oaks, CA (US);
Douglas Meyers, Calabasas, CA (US);
Mark Morris, Calabasas, CA (US);
D. Laurence Meixner, Camarillo, CA (US);
Satyabrata Raychaudhuri, Thousand Oaks, CA (US);
Yazaki Corporation, , JP;
Abstract
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.