The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Apr. 14, 2005
Applicants:
Hiroshi Kanoh, Tokyo, JP;
Kazushige Takechi, Tokyo, JP;
Narumoto Uesaka, Tokyo, JP;
Kazuo Nikami, Tokyo, JP;
Inventors:
Hiroshi Kanoh, Tokyo, JP;
Kazushige Takechi, Tokyo, JP;
Narumoto Uesaka, Tokyo, JP;
Kazuo Nikami, Tokyo, JP;
Assignees:
NEC Corporation, Tokyo, JP;
Nagase & Co., Ltd., Osakai-shi, Osaka, JP;
Sanwa Frost Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/14 (2006.01); B32B 38/10 (2006.01); B32B 37/06 (2006.01); H01L 21/304 (2006.01); B32B 37/10 (2006.01); H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered to the part of the substrate, the protective material is easily peeled away. As a result, the time required for peeling can be decreased, and cracking of the device which may occur in peeling can be prevented.