The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7381061 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 03, 2008

Filed:

Dec. 03, 2006
Applicants:

Yi-ching Hung, Taoyuan Hsien, TW;

Chien-yu Hsu, Taoyuan Hsien, TW;

Robert Chiang, Taoyuan Hsien, TW;

Inventors:

Yi-Ching Hung, Taoyuan Hsien, TW;

Chien-Yu Hsu, Taoyuan Hsien, TW;

Robert Chiang, Taoyuan Hsien, TW;

Assignee:

Speed Tech Corp., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high density electrical connector to connect an electronic device and a printed circuit board includes a connector body disposed on the printed circuit board, several terminal channels disposed in the connector body, and several terminals disposed in the terminal channels. The printed circuit board has several contact points. Each terminal has an extending portion to connect with the contact points of the printed circuit board. Another end of the terminal has a joint generated by separating with a carrier. A method for assembling the high density electrical connector is also disclosed.


Find Patent Forward Citations

Hung, Yi-Ching. (2008). High density electrical connector (U.S. Patent No. 7381061). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7381061

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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