The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7380467 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 03, 2008

Filed:

May. 01, 2006
Applicants:

Chong T. OH, Lexington Park, MD (US);

William E. Farrell, Avenue, MD (US);

William T. Jacoby, Lusby, MD (US);

Bernard W. Baird, Avenue, MD (US);

Inventors:

Chong T. Oh, Lexington Park, MD (US);

William E. Farrell, Avenue, MD (US);

William T. Jacoby, Lusby, MD (US);

Bernard W. Baird, Avenue, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to a bond integrity tool, which includes a shoulder housing, a collar shaft, and an end cap. The collar shaft has a neck portion and a mouth portion. The neck portion is disposed within the shoulder housing, and the mouth portion is able to grip a test piece. The end cap communicates with the neck portion, such that when the end cap is initiated the end cap applies force on the shoulder housing, which in turn applies force on the collar shaft, which grips the test piece such that the bond integrity between the test piece and a surface may be tested.


Find Patent Forward Citations

Oh, Chong. (2008). Bond integrity tool (U.S. Patent No. 7380467). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7380467

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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