The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2008
Filed:
Dec. 04, 2002
Keiji Yasuda, Handa, JP;
Masahiro Kimura, Chiryu, JP;
Hisayoshi Okuya, Nishio, JP;
Hidetoshi Yata, Okazaki, JP;
Hiroyoshi Ito, Obu, JP;
Masayuki Nishiguchi, Aichi-ken, JP;
Naoki Mizuno, Nagoya, JP;
Keiji Yasuda, Handa, JP;
Masahiro Kimura, Chiryu, JP;
Hisayoshi Okuya, Nishio, JP;
Hidetoshi Yata, Okazaki, JP;
Hiroyoshi Ito, Obu, JP;
Masayuki Nishiguchi, Aichi-ken, JP;
Naoki Mizuno, Nagoya, JP;
Aisin Seiki Kabushiki Kaisha, Kariya-Shi, Aichi-Ken, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, Aichi-Ken, JP;
Abstract
A holding structure of an electronic component includes a first resin mold formed by resin insert molding with a terminal. The first resin mold possesses a positioning portion for positioning the electronic component to be electrically connected to the terminal. The holding structure includes a second resin mold formed by resin insert molding with the terminal and surrounding the first resin mold and the electronic component. The electronic component has been positioned by the first resin mold and has been electrically connected to the terminal.