The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
May. 22, 2002
Christopher H. Husmann, Gardena, CA (US);
Chi H. Sheu, Los Angeles, CA (US);
Denise M. Shimazu, Los Angeles, CA (US);
Christopher H. Husmann, Gardena, CA (US);
Chi H. Sheu, Los Angeles, CA (US);
Denise M. Shimazu, Los Angeles, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
According to one embodiment of the invention, a co-cured resin transfer molding manufacturing method includes providing a tool having one or more tooling details and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium outwardly from the one or more tooling details, disposing a prepreg skin panel outwardly from the high permeability medium, disposing the one or more tooling details and the prepreg skin panel within the tool, injecting a resin into the one or more preforms, and curing the one or more preforms and the prepreg skin panel.