The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Aug. 15, 2005
Masayuki Kozawa, Hitachinaka, JP;
Shinya Igarashi, Naka, JP;
Nobuhito Hiramatsu, Hitachinaka, JP;
Naoki Saito, Tokai, JP;
Hiromu Kikawa, Hitachinaka, JP;
Masayuki Kozawa, Hitachinaka, JP;
Shinya Igarashi, Naka, JP;
Nobuhito Hiramatsu, Hitachinaka, JP;
Naoki Saito, Tokai, JP;
Hiromu Kikawa, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Car Engineering Co., Ltd., Tokyo, JP;
Abstract
A thermal type air flow measuring instrument has a molded part formed by integral molding with a metal plate. A slot or opening allowing only a resin to pass through the same is formed in the metal plate in an area subjected to higher stresses. A part of the connector terminals are disposed in the vicinity of an area where the resin has a larger thickness and the temperature difference between the inside and the outside of the resin is locally increased. The injecting direction is set to prevent a weld line and a void from being generated. For the molded part with the metal plate inserted therein, the occurrence of cracks is minimized. Further, an increase of the fatigue crack growth rate is decreased.