The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2008
Filed:
Oct. 10, 2003
Sam-jong Choi, Gyeonggi-do, KR;
Gi-jung Kim, Gyeonggi-do, KR;
Kyoo-chul Cho, Gyeonggi-do, KR;
Yeon-sook Kim, Gyeonggi-do, KR;
Shin-hyeok Han, Seoul, KR;
Hoe-sik Chung, Gyeonggi-do, KR;
Sam-Jong Choi, Gyeonggi-do, KR;
Gi-Jung Kim, Gyeonggi-do, KR;
Kyoo-Chul Cho, Gyeonggi-do, KR;
Yeon-Sook Kim, Gyeonggi-do, KR;
Shin-Hyeok Han, Seoul, KR;
Hoe-Sik Chung, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.